Product No:
Product Name: LED UV 8”De-bonding machine

LED UV 8”De-bonding machine

The UV de-bonding machine can provide fast lighting, uniform and stable and long-life UV light source. It is used in the de-bonding process after 8-inch wafer cutting, and can also be customized according to customer needs.

 

 

LED UV Product Specifications

Lumtec-250250-8DB

Item

Specifications

Irradiation range

250mm x 250mm

UV Light intensity

Min 100  mW/cm2

Temperature protection

65

UV Wavelength  

360~370 nm

Machine Size (L x W x H)

350mm x 350mm x 150mm (Estimate)

Weight

15Kg (Estimate)

Power module*1

Input AC Voltage

110~220 V

Current

3.5 A

Power Consumption

700 W (Depending on UV Wavelength)

Dimming system

0-100% manual adjustment

Start method

Button start

LED lighting time setting

1S~99Hr99Min

Cooling method

Fan